Industry News | 2017-10-05 19:30:49.0
Nordson MARCH will present the paper, Enhancing the Performance of Printed Circuit Board Assemblies Using Plasma Treatment, at SMTA Guadalajara 2017. David Foote, Global Applications Manager, Nordson MARCH, will discuss the fundamentals of plasma treatment. Specific applications and examples will be shown to demonstrate the many uses and benefits of plasma processing for printed circuit board assemblies (PCBAs), including managing electrostatic discharge (ESD) damage.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
Industry News | 2014-01-29 14:32:03.0
Engineered Material Systems (EMS) debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications.
Industry News | 2015-04-21 16:27:46.0
KYZEN has been honored with a 2015 SMT China Vision Award. This year’s award recognizes KYZEN’s ph Neutral Electronic Assembly Cleaning Chemistry AQUANOX® A4708, a highly-specialized solution for low-gap PCB assembly cleaning.
Industry News | 2015-11-01 18:53:43.0
KYZEN announces that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, Nov. 5, 2015 at The Grand Event Center. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
Industry News | 2015-11-04 20:26:00.0
KYZEN today announced that it will exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 12, 2015 at the Melbourne Auditorium in FL. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2021-04-09 02:12:31.0
The reaction between the plasma surface treatment machine and the surface of the material is both physical and chemical. Through the reaction, the surface of the material will become rough, and at the same time, the oxide can be reduced, making the surface of the material hydrophilic and cohesive. Dyeability, biocompatibility and electrical properties have been greatly improved.
Industry News | 2015-01-19 21:50:28.0
KYZEN’s innovative new product technology team is introducing its new AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry in Booth #1011 at the IPC APEX EXPO. The EXPO tales place Feb. 24-26, 2015 at the San Diego Convention Center in California.
