Industry News: bottom terminated components void (Page 7 of 12)

Highly Dense Electronic Hardware at IEMT-EMAP 2016

Industry News | 2016-09-15 18:20:55.0

KYZEN is pleased to announce plans to exhibit and present during the conferences at IEMT-EMAP 2016, scheduled to take place Sept. 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd’s Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”

KYZEN Corporation

Innovations at SMTA Penang

Industry News | 2016-09-16 15:53:13.0

KYZEN is pleased to announce that it will exhibit and present at the SMTA Penang Vendor Show, scheduled to take place Sept. 23, 2016 at the Eastin Hotel Penang. T.C. Loy, KYZEN Sdn Bhd’s Technical Sales Manager, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”

KYZEN Corporation

Indium Corporation Experts to Present at APEX 2016

Industry News | 2016-02-16 20:18:38.0

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.

Indium Corporation

Dr. Mike Bixenman to Teach a Workshop on Reliability, Contamination, Cleaning and Process Control during SMTAi

Industry News | 2017-09-05 14:08:01.0

KYZEN is pleased to announce that Dr. Mike Bixenman will conduct a special workshop during the SMTA International Technical Conference, scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL. The workshop, entitled “Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies,” is scheduled to take place Monday, Sept. 18 from 1:30-5 p.m.

KYZEN Corporation

SIPAD Systems will be in the North Carolina area 2 times in November

Industry News | 2011-10-21 18:13:35.0

The first event is PCB Carolina on November 8th at the Raleigh Convention Center, the second event will be the following week when Matt Kehoe will be speaking along with Dr. Dan Baldwin at the SMTA Carolina Chapter meeting.

SIPAD Systems Inc.

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

Industry News | 2017-05-22 17:36:43.0

KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.

KYZEN Corporation

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Industry News | 2019-08-29 21:58:20.0

PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.

PACE Worldwide

Dr. Mike Bixenman to Present during the Technical Conference at APEX

Industry News | 2017-01-30 19:56:21.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present two papers at the upcoming IPC APEX EXPO at the San Diego Convention Center. “Electrochemical Methods to Measure the Corrosion Potential of Flux Residues” will be presented during Session S04 on Tuesday, Feb. 14, 2017 from 1:30-3 p.m. The paper was co-authored by David Lober and Anna Ailworth, KYZEN, and Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean and Kyle Loomis from Kester Corporation. The paper entitled, “Does Cleaning the PCB before Conformal Coating Add Value?” will be presented during Session S20 on Wednesday, Feb. 15, 2017 from 1:30-3 p.m. The paper was co-authored by Mark McMeen and Jason Tynes, STI Electronics, and Gustavo Arredondo, ParaTech Coating.

KYZEN Corporation

New Online Webinars from the Desk of Bob Willis

Industry News | 2017-10-23 05:53:04.0

Selected Bob Willis webinars are released for the end of 2017 and the beginning of 2018. Book online to secure your place or for your team training. If the date or time does not suit your schedule its also possible to arrange online training at a time and date that is better for you http://www.bobwillis.co.uk

ASKbobwillis.com

Join Murray Percival Co. & Magnalytix for a Technical Webinar

Industry News | 2021-02-18 10:41:08.0

The Murray Percival Company today announced they will be hosting a FREE webinar in partnership with Magnalytix on March 4, 2021, from 1-1:45 p.m. Eastern time.

Murray Percival


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