Industry News | 2009-11-01 18:10:15.0
The SIPLACE Team is so confident in its new affordable SIPLACE SX concept of "Real Capacity on Demand" that they have taken to the road in the Americas to spread the word. The SIPLACE team is performing live gantry upgrade demonstrations at record breaking speeds. The team is revealing how quickly and easily you can add placement performance to a line without influencing feeder capacity or line length; how easily placement capacity can be moved from one line to another; and how easily feeder capacity can be added without the cost of adding an entire new machine.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2006-02-24 16:25:58.0
New MOSFET+Drivers Provide Operation up to 1 MHz and 3 % Better Efficiency Than Discrete Solutions
Industry News | 2008-10-25 23:25:32.0
OK International has launched the new Metcal MX-5000 Series Soldering and Rework System. Combining increased power and an enhanced hand-piece with unique energy and tip-saving features, the Metcal Soldering and Rework Systems represent a high performance package to meet the demands of complex assembly challenges.
Industry News | 2009-10-15 08:43:05.0
Live Gantry Upgrade Demonstrations Prove SIPLACE Strength in Innovation
Industry News | 2015-11-04 20:05:54.0
Saki Corporation announces that its new 3D automated optical inspection, solder paste, and x-ray technology and equipment will be demonstrated at Productronica 2015, in Stand A2.239, as part of the theme "From Inspection to Measurement."
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
Industry News | 2017-01-11 18:43:28.0
Saki Corporation, an innovator in the field of automated optical inspection equipment, will exhibit its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems and their Smart Factory and Industry 4.0 capabilities at IPC APEX 2017, San Diego, CA, in booth 2909. Saki's inspection and measurement systems can be used to communicate with equipment in printed circuit board assembly lines to ensure that the PCBs are produced efficiently and adhere to the highest standards of quality and reliability.
Industry News | 2019-01-28 20:05:21.0
Cogiscan Inc.are pleased to announce a new strategic partnership.
Industry News | 2002-04-09 08:32:44.0
Newest 300mm OEM Tool-to-Carrier Interface Raises the Bar for Reliability, Interoperability and Cost of Ownership
