Industry News | 2011-04-04 16:45:12.0
JUKI and AEGIS Software announce a unique integration of JUKI’s new Intelligent Shop Floor Solutions software package (IS) with CircuitCAM Express for fast data preparation and facility-wide programming.
Industry News | 2013-03-12 16:26:29.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Dallas and Houston Expo & Tech Forums.
Industry News | 2013-05-07 17:59:59.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Thursday May 16, 2013 at the Sheraton Toronto Airport Hotel & Conference Centre in Ontario. Keith Howell, Technical Director at Nihon Superior, will hold a technical presentation on nano silver replacement for high lead solders in semiconductor junctions.
Industry News | 2013-05-28 14:10:40.0
Kyzen announces that Vice President Tom Forsythe will present at a joint cleaning and reliability workshop held in cooperation with Aqueous Technologies, FCT Assembly and Nordson DAGE.
Industry News | 2013-05-28 14:17:55.0
FCT Assembly announces that Greg Smith, Regional Sales Manager and Technical Support, will present at a joint cleaning and reliability workshop held in cooperation with Aqueous Technologies, Kyzen and Nordson DAGE.
Industry News | 2013-06-04 16:10:09.0
Kyzen, together with HumiSeal, Stoelting and Nordson ASYMTEK, will present a cleaning and reliability workshop hosted by ACI Technologies on Wednesday, June 19, 2013 from 8:30 a.m. to 4 p.m. in Philadelphia, PA.
Industry News | 2015-09-17 16:33:30.0
The VUB300 is a single-chip USB-to-SDIO hardware bridge that allows SDIO- and SD-compliant devices to be connected to a host PC via its USB port.
Industry News | 2017-06-22 12:59:47.0
This 2000L 2LE model is capable of imaging a maximum size 24” x 24” PC board or film size. With any large format film, positional accuracy can be a challenge but the Miva’s dynamic scaling feature can increase accuracy to minimize tolerance build-ups during the imaging process. Due to Miva’s optical registration system, innerlayer drill break-out will be reduced considerably on densely routed signal layers which will significantly improve yields. For sub-20-mil pitch parts or micro BGAs, a 2−3 mil solder dam will be possible to eliminate bridging during the assembly process.
Industry News | 2017-07-11 14:54:43.0
The CS448 is a unique isolated four-channel 200MHz 14-bit oscilloscope designed to measure high voltage, fast slew-rate signals such as those in a full or three-phase power electronic switching bridge.
Industry News | 2018-10-18 07:56:58.0
Wave soldering process defectives and handling solution
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