Industry News: bridges (Page 15 of 52)

Integrated Ideas & Technologies, Inc. has developed a new prototype solder paste printing tool.

Industry News | 2008-11-20 16:12:46.0

Integrated Ideas & Technologies, Inc. announces the Desktop Companion II

Integrated Ideas & Technologies, Inc.

EVS International’s High Solids High Flow Filtration System Recognized As Best European Product

Industry News | 2010-10-29 22:37:50.0

EVS International announces that it has been awarded a Global Technology Award in the category of Best European Product for the High Solids High Flow Filtration System on its Lead-Free EVS 9000.

EVS International

Christopher Associates Introduces Large-Format X-ray System

Industry News | 2011-07-13 14:57:19.0

Christopher Associates has released the Akila XR-3L large-format X-ray system for printed circuit fabrication and assembly applications.

Christopher Associates Inc.

Christopher Associates Debuts Remote Live Option for the Tagarno Magnus HD

Industry News | 2011-07-20 11:53:48.0

Christopher Associates Inc announced the release of its new Remote Live option for the Tagarno Magnus HD Inspection System. Remote Live enables streaming of the Tagarno Magnus HD’s signal, allowing users in different buildings (or different parts of the world) to share the same field of view.

Christopher Associates Inc.

Lynx – New Small Form Factor SMT Assembly System

Industry News | 2014-12-17 03:27:46.0

Due to popular demand, Essemtec AG launches a new small form factor SMT placement machine.

ESSEMTEC AG

MET Stencil Launches NanoSlic® Gold coated Stencil

Industry News | 2016-02-10 17:03:46.0

MET Stencil announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world's most advanced stencil coating technology for improving solder paste printing. "We are pleased to announce that we have been licensed by FCT Assembly to sell this coating to the US market.” said Fred Cox, President of MET Stencil. "Stencil users will immediately see the benefits in their print."

MET Stencil

Microtek Adds FINEPLACER® Lambda Die Bonder to New Facility

Industry News | 2016-07-25 15:46:30.0

Finetech, a global supplier of micro-assembly equipment, and Microtek, a microelectronics product development innovator, announce the addition of a FINEPLACER® Lambda bonding system at the recently opened Microtek facility. The die bonder will be used for customized packaging applications in prototype and development projects, including wireless, photonics and medical diagnostics and therapeutics.

Microtek, Inc.

EVS Helps Reduce Waste Dross by 85 Percent! Learn More at APEX

Industry News | 2017-01-09 18:20:54.0

EVS International will showcase the new EVS 500LF lead-free version and EVS 8KLFHS in the Sono-Tek booth (#2700) at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.

EVS International

Graco AFD Announces New InvisiPac® Feed System

Industry News | 2017-05-08 12:21:48.0

Ensures reliable feed and reduces adhesive clumping that results in downtime

Graco, Inc.


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