Industry News | 2014-07-14 06:48:21.0
unced that it will exhibit at the Ohio SMTA Expo & Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland – Independence.
Industry News | 2014-10-30 19:03:02.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch, European X-Ray Application Engineer, will present at their Distributor Etek’s Technology Event, scheduled to take place November 5-6, 2014 in Prestwick, Scotland. Koch will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.”
Industry News | 2014-11-22 07:42:40.0
FCT Assembly today announced plans to exhibit at the Space Coast and Tampa Bay Expo & Tech Forum, scheduled to take place Thursday, December 4, 2014 at the Park Inn by Radisson in Kissimmee, FL. Solder expert Rodney Wade will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution-driven solder pastes.
Industry News | 2015-01-07 10:19:54.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in Booth #1211 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the multi-functional SMT center Paraquda, Cubus SMT storage device and the new Lynx highly flexible and accurate pick-and-place system.
Industry News | 2015-01-22 17:40:23.0
Essemtec will exhibit in Booth #1211 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the multi-functional SMT center Paraquda, Cubus SMT storage device and the new Lynx highly flexible and accurate pick-and-place system.
Industry News | 2015-01-25 15:51:36.0
FCT Assembly today announced plans to exhibit at the SMTA Rocky Mountain Expo Tech Forum, scheduled to take place Wednesday, Jan. 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Solder experts will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution driven solder pastes.
Industry News | 2015-03-03 13:11:14.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany.
Industry News | 2015-05-12 16:59:43.0
Essemtec today announced that it will participate in ACI Technologies’ second annual Tech Expo, scheduled to take place May 20-21, 2015 at its facility in Philadelphia, PA. Steve Pollock, Vice President of Essemtec USA, will demonstrate the Paraquda G2, Cubus and Lynx on the factory floor.
Industry News | 2015-09-01 13:01:04.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015 (www.smta.org/smtai/), as well as take part in the conference program and live process demonstrations on the show floor.
Industry News | 2015-09-16 10:43:38.0
Inovar announces that it recently purchased and installed four MS-11 solder paste inspection (SPI) systems from MIRTEC.
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