Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2011-05-19 22:54:11.0
The recently completed implementation of Aegis Manufacturing Operations Software allows Concept 2 Market, Inc. (C2M) to improve efficiencies and quality by streamlining and controlling process planning and launch, process tracking and control, and quality and test management.
Industry News | 2011-12-01 14:01:34.0
Ersa has expanded its product range by the ECOSELECT 1: a selective soldering machine requiring less than 3 m² of space - thus fitting optimally into cell production environments.
Industry News | 2012-03-09 12:20:19.0
YAMAHA MOTOR IM and AEGIS Software announce that a technology agreement has been reached with the two companies. AEGIS is the first MES supplier to join YAMAHA’s new 3rd party certification program. As part of this certification, AEGIS will have access to YAMAHA’s API information providing mutual customers with a solution for programming their equipment offline.
Industry News | 2012-08-01 16:44:06.0
Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2013-03-21 09:14:58.0
EVS International, will debut the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor SMA Technologies’ Booth # L70 at the upcoming 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
Industry News | 2013-03-27 16:51:17.0
EVS International, will debut the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor SMA Technologies’ Booth # L70 at the upcoming 27th International Electrical, Energy and Automation Industry Fair (FIEE)
