Industry News | 2017-01-25 13:12:06.0
NEO Tech announces that it will exhibit its medical design service solutions, as well as medical device repair and refurbishment, and miniaturization services for implantable medical electronics from February 7-9 at the 2017 MD&M West Exhibition in Anaheim. NEO Tech’s technology and medical solution expert team members will be located in booth 673.
Industry News | 2017-02-23 13:23:33.0
Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.
Industry News | 2018-01-28 16:15:48.0
Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-04-03 08:04:48.0
Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-07-24 06:27:57.0
Nihon Superior scheduled to take place Aug. 28-30, 2018 at the Shenzen Convention & Exhibition Center. The company will debut the new SN100CV™ P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-09-18 20:11:02.0
Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
Industry News | 2018-10-18 10:51:08.0
How Conformal Coating Protects PCBs
Industry News | 2018-10-18 11:13:35.0
PCB Outline Layer And Keep-out Polygon Clearance
Industry News | 2019-01-31 19:57:24.0
Data I/O Corporation is pleased to announce that it has received a 2019 NPI Award in the category of Device Programming for the new Job Composer Software Application for the LumenX programming engine. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
