Industry News: bridges (Page 7 of 52)

TECH POLICY VETERAN KENNETH SCHRAMKO JOINS LEADING ELECTRONICS INDUSTRY ASSOCIATION IPC

Industry News | 2014-06-04 14:49:33.0

IPC — Association Connecting Electronics Industries® announced that Kenneth Schramko has joined its Washington, D.C.-based government relations team as director of government relations.

Association Connecting Electronics Industries (IPC)

MPM Introduces Next Generation Momentum II Printer

Industry News | 2019-11-05 12:11:26.0

ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.

ITW EAE

Electrovert 'DwellFlex 4.0' Wave Solder Nozzle Wins New Product Innovation Award at IPC APEX 2020

Industry News | 2020-04-14 18:49:39.0

EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.

ITW EAE

MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models

Industry News | 2020-04-14 19:07:23.0

ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.

ITW EAE

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Industry News | 2020-04-14 22:14:18.0

ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.

ITW EAE

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE

IPC Welcomes New Director of North American Government Relations

Industry News | 2023-01-23 16:45:05.0

IPC announces the addition of Jeffrey Goldberg as director of North American government relations to its staff at IPC's offices in Washington, D.C. In this role, Goldberg will help lead IPC's federal advocacy work in collaboration with IPC's Government Relations Committee and IPC's Vice President of Global Government Relations Chris Mitchell. He will be charged with implementing an ambitious North American policy agenda at a time of increased interest among policymakers in the electronics supply chain.

Association Connecting Electronics Industries (IPC)

I.C.T Elevating SMT Turnkey Solutions with Global Localization and Strategic Alliances

Industry News | 2023-09-08 04:07:38.0

I.C.T Elevating SMT Turnkey Solutions with Global Localization and Strategic Alliances

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMTA Announces Workforce Development Collaborative in Minnesota

Industry News | 2023-11-06 12:17:35.0

SMTA is proud to announce the official launch of the SMTA Minnesota Workforce Development Collaborative, an ambitious initiative aimed at empowering the region's workforce and promoting economic growth.

Surface Mount Technology Association (SMTA)

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for "Advanced Packaging" Technologies

Industry News | 2024-03-04 12:05:31.0

IPC praised today's issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

Association Connecting Electronics Industries (IPC)


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