Industry News | 2012-02-23 14:43:13.0
IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2017-03-14 10:44:55.0
Developed by XJTAG®, the free software for PADS® Schematic Design will significantly increase the Design for Test and Debug capabilities of the schematic capture and PCB design environment.
Industry News | 2013-10-25 16:15:31.0
Barry Industries introduces a new 0904 size chip attenuator for Ku, K and Ka bands. The AV0904GA attenuator has been characterized to 30GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750mW.
Industry News | 2014-08-05 17:29:07.0
Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2013-07-17 13:47:09.0
JNJ Industries' SmartHolder was designed specifically for JNJ's SuperSaturated SmartWipes® canisters, to keep them readily available and easily accessible.
Industry News | 2021-05-21 12:12:03.0
Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life
