Industry News | 2013-04-04 11:07:31.0
MIRTEC announces that it has been chosen as the exclusive AOI partner for Bosch for the next five years.
Industry News | 2015-03-05 08:49:38.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has named the Murray Percival Company ‘MIRTEC Manufacturers’ Representative Organization of the Year 2014’. Brian D’Amico, President of MIRTEC Corp., presented the award to the company during the recent IPC APEX EXPO in San Diego, CA.
Industry News | 2016-12-18 14:04:42.0
MIRTEC, “The Global Leader in Inspection Technology,” today announced that Accurex Solutions of India has won their 2016 Sales Award, leading in equipment sales for all MIRTEC Europe distributors. For 29 years, Accurex Solutions has been the leading manufacturers’ supplier and service provider in India.
Industry News | 2018-05-20 18:15:51.0
MIRTEC, “The Global Leader in Inspection Technology,” today announced that Electrica Ltd. purchased an MV-3 OMNI 3D AOI system to help increase quality and productivity throughout all phases of their manufacturing process as the company engages with more customers in the high-reliability markets.
Industry News | 2020-03-25 12:00:41.0
After an extensive evaluation BOSCH has selected MIRTEC's 3D AOI Technology as the best solution to meet their ongoing quality initiatives.
Industry News | 2020-07-22 04:45:00.0
MIRTEC is pleased to announce that Check Technology Solutions has purchased an MV-6 OMNI 3D AOI machine to meet their ongoing commitment to flawless manufacturing quality. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable Check Technology Solutions to achieve 100% customer satisfaction.
Industry News | 2021-01-10 05:22:47.0
MIRTEC announce that European Circuits Limited purchased an MV-3 OMNI Desktop 3D AOI Machine. The purchase was facilitated through Bentec Ltd.
Industry News | 2003-03-19 08:25:45.0
Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
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