Industry News | 2011-09-12 15:42:18.0
For the past year, engineers from companies like Honeywell Aerospace and Rockwell Collins have been meeting to lay the groundwork for IPC-A-630, Requirements and Acceptance for Enclosures, better known as “the box build standard.” These volunteers have come largely from the OEMs that specify the cabinetry they will use.
Industry News | 2012-09-12 16:56:07.0
Count On Tools Inc will exhibit in Booth #211 at the upcoming SMTA International Conference and Expo
Industry News | 2014-01-07 18:55:28.0
Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.
Industry News | 2011-10-03 01:45:15.0
Adding to the excitement of the IPC Midwest Conference & Exhibition held last week was the first U.S. IPC hand soldering competition. Twenty-two competitors from 15 companies were tasked with building a functional electronics assembly within a half hour.
Industry News | 2012-04-19 09:20:51.0
Count On Tools has released its compact ezLOAD 40 Series PCB Support System.
Industry News | 2012-05-18 17:26:11.0
IPC Midwest Conference & Exhibition. Participants will compete against each other to build a functional electronics assembly within a half-hour time limit to ultimately determine who the best-of-the-best is in the Midwest.
Industry News | 2012-06-26 14:16:01.0
Count On Tools Inc.introduces the new ezLOAD XL PCB Support System.
Industry News | 2012-11-27 18:13:48.0
IPC – Association Connecting Electronics Industries® announces the appointment of Philip S. Carmichael as its new president of IPC China. Carmichael will be visiting Greater China in December 2012 and will relocate in January 2013.
Industry News | 2020-01-16 16:35:00.0
IPC Design will serve as the pre-eminent international professional network of board designers. At its core will be IPC Design Chapters, localized groups of professionals with board design responsibilities. Members of IPC Design Chapters will be organized around three key goals:
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
