Industry News: bumping (Page 1 of 27)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Nordson ASYMTEK Introduces Continuous Path Motion Control Software

Industry News | 2013-08-20 23:02:16.0

Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.

ASYMTEK Products | Nordson Electronics Solutions

Count On Tools Introduces Universal Instruments’ GSM Special Low Force Nozzle with Replaceable Tips for Delicate Components

Industry News | 2010-05-20 12:47:37.0

GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.

Count On Tools, Inc.

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Industry News | 2016-06-19 19:44:55.0

The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

SMTA International

Industry News | 2007-09-24 17:54:39.0

With less than two weeks until SMTA International (Orlando, Florida, October 7 -11) the SMTA is pleased to report that the goals for a meaningful and unique event are becoming a reality. Designed for our industry, by our industry, SMTAI is the one exhibition that allows you to focus exclusively on your major programs and projects.

Surface Mount Technology Association (SMTA)

IPC APEX EXPO 2014 TECHNICAL CONFERENCE SPOTLIGHTS CHANGING TECHNOLOGIES

Industry News | 2014-02-03 18:00:07.0

Changing technologies that are driving the electronics industry will be center stage throughout the IPC APEX EXPO® technical conference, which takes place Tuesday, March 25 to Thursday, March 27, 2014, at the Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

SMTA International 2014 Best Papers Announced

Industry News | 2015-01-07 15:52:18.0

The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

Industry Reconnects as IPC APEX EXPO 2022 Reconvenes as In-person Event

Industry News | 2022-02-07 17:26:54.0

From revolutionary innovations displayed on the show floor to expert insights conveyed in technical conference sessions, professional development courses and standards development committee meetings, IPC APEX EXPO 2022 provided the education and networking connections that helped 3,647 visitors address today's business challenges and prepare for their factories of future.

Association Connecting Electronics Industries (IPC)

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