Industry News: bumps on (Page 1 of 2)

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Industry News | 2016-08-23 16:30:00.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.

Shenmao Technology Inc.

DEK Raises the Bar on DirEKt Coat™ Technology

Industry News | 2009-08-10 20:22:02.0

2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.

ASM Assembly Systems (DEK)

Christopher Associates/Koki Solder to Present Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Applications at SMTAI 2010

Industry News | 2010-09-27 23:01:06.0

Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

See Kyzen’s MICRONOX® MX2302 Wafer-level Cleaning Solution on Display at IWLPC 2010

Industry News | 2010-09-13 15:55:58.0

Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will display its MICRONOX® MX2302 Wafer-level Cleaning Solution at the upcoming International Wafer-Level Packaging Conference and Tabletop Exhibition, scheduled to take place October 13-14, 2010 at the Marriott Hotel in Santa Clara, CA

KYZEN Corporation

DEK Wafer Level Process Expertise on Show at Semicon West 2010

Industry News | 2010-06-21 16:04:54.0

Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.

ASM Assembly Systems (DEK)

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Semicon West 2012

Industry News | 2012-07-06 19:44:05.0

Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Semicon West 2012

Industry News | 2012-07-06 19:44:24.0

Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the Ultra 850G AOI at Semicon West 2012

Industry News | 2012-07-06 19:44:43.0

Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the MVP 850G AOI at Productronica 2013

Industry News | 2013-11-06 14:17:59.0

Machine Vision Products will be demonstrating its 850G inspection solutions on Booth 220 in Hall A2 at the Productronica 2013 exhibition.

Machine Vision Products, Inc

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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

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