Industry News: burnin solder (Page 1 of 3)

How to optimize the reflow profile?

Industry News | 2018-10-18 08:37:41.0

How to optimize the reflow profile?

Flason Electronic Co.,limited

Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019

Industry News | 2019-02-09 20:43:45.0

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.

Indium Corporation

ECT’s CPG TO FEATURE SEMICONDUCTOR PROBES AT BiTS 2010

Industry News | 2010-02-11 16:19:54.0

Pomona, CA, February 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest semiconductor probes at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.

Finetech

Indium Corporation Expands Sales Network in Western USA

Industry News | 2008-08-14 13:24:31.0

Recht Associates now sells Indium Corporation's Thermal Interface Materials (TIM) � solder TIMs, non-reflow products, compressible TIM Heat-Spring�, liquid metal, and burn-in TIM.

Indium Corporation

DDM Novastar Delivers Custom Pick-and-Place Machine

Industry News | 2016-08-16 08:38:12.0

DDM Novastar, a U.S. manufacturer of SMT and PCB assembly equipment, shipped a custom pick-and-place machine to a large multi-national laser cutting tool manufacturer.

DDM Novastar Inc

ECT’s CPG To Showcase the ZIP® Family at BiTS™ Burn-In & Test Socket Workshop

Industry News | 2011-02-26 16:22:43.0

Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth A04 at the upcoming BiTS™ Burn-In & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

Multitest’s Ryan Satrom to Present at BiTS 2010

Industry News | 2010-02-12 09:54:05.0

Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Ryan Satrom and Valts Treibergs will present a paper titled “An Improved Characterization Technique for Contactors” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/ Mesa Hotel in Mesa, Ariz. The presentation will be held during Session 4, which will take place Tuesday March 9, 2010 at 10:30 a.m.

Multitest Elektronische Systeme GmbH

Everett Charles Technologies’ CPG Receives a Patent for Its ZIP® Family of Flat Technology Pogo® Pins

Industry News | 2011-02-23 20:02:51.0

Everett Charles Technologies’ Contact Products Group (CPG) has been awarded US Patent Number: 7,862,391for its ZIP® family of flat technology Pogo® pins.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

ECT’s CPG TO SHOWCASE THE ZIP® FAMILY AT THE INTERNATIONAL TEST CONFERENCE

Industry News | 2011-08-24 13:24:13.0

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of “flat” technology Pogo® pins in booth 114 at the upcoming International Test Conference (ITC)

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop

Industry News | 2018-10-25 15:16:16.0

Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.

Indium Corporation

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