Industry News | 2021-09-02 05:46:58.0
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper "Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells" at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2011-06-01 23:22:00.0
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Industry News | 2012-04-25 16:26:47.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that Dr. Frank Bottari and Dr. Tianming Bao presented technical papers at the China PV Technology International Conference (CPTIC)
Industry News | 2009-04-17 15:35:22.0
DEK is showing its next generation solar metallization line solutions at the SNEC PV Power Expo 2009 event in Pudong, Shanghai from the 6th to 8th May. The screen printing specialist is previewing details of its latest high-throughput PV3000 silicon cell metallization concept and running its state-of-the-art PV1200 metallization line live in Hall 6, Booth T621.
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