Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-09-27 17:08:37.0
Engineered Material Systems, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-12-05 14:37:56.0
Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.
Industry News | 2017-09-13 14:24:45.0
Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.
Industry News | 2015-12-05 16:34:44.0
Engineered Materials Systems will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.
Industry News | 2016-10-06 09:52:01.0
Engineered Material Systems will exhibit at Semicon Europa, scheduled to take place Oct. 25-27, 2016 in Grenoble, France. Company representatives will showcase both liquid and dry-film negative photoresist for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry film) and processing on MEMS and IC wafers.
Industry News | 2015-08-26 19:14:09.0
Engineered Materials Systems will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy.
Industry News | 2013-10-29 13:26:58.0
Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).