Industry News: camalot 3800 issues (Page 1 of 1)

IPC Issues Statement on the 2016 Election Results

Industry News | 2016-11-09 17:23:15.0

John Mitchell, president and CEO of IPC, issued the following statement on the United States’ election results.

Association Connecting Electronics Industries (IPC)

PCB Executive Forum Focuses on Critical Issues Senior-level executives to meet at IPC APEX EXPO

Industry News | 2016-11-17 18:53:39.0

IPC – Association Connecting Electronics Industries® announces the new PCB Executive Forum Presented by IPC Hall of Fame. This is a learning and networking forum for senior-level executives of PCB organizations, fabricators, and their suppliers. The forum will take place February 13 at IPC APEX EXPO in San Diego, Calif.

Association Connecting Electronics Industries (IPC)

Newly Elected Congressman Discusses U.S. Policy Priorities with Bay Area Manufacturers

Industry News | 2016-12-27 14:02:11.0

Executives and staff at a San Francisco Bay Area manufacturing facility held a town hall discussion with Rep. Ro Khanna (D-CA-17) on the federal policy issues facing the manufacturing industry under the Trump Administration. Rep. Khanna took a tour of IPC-member company TTM Technologies, Inc. (“TTM”), getting a first-hand look at the work taking place in its Santa Clara, California facility.

Association Connecting Electronics Industries (IPC)

Experience Technology’s Turning Point Through IPC APEX EXPO 2017 Free Networking Opportunities

Industry News | 2016-12-20 12:59:02.0

IPC APEX EXPO 2017 attendees can network with industry colleagues, make new connections, and interact with more than 450 exhibitors in one place at one time at the San Diego Convention Center, February 14–16.

Association Connecting Electronics Industries (IPC)

Henkel Launches Next-Gen Underfill that has it All

Industry News | 2009-05-26 18:16:29.0

In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.

Henkel Electronic Materials

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