Industry News | 2008-03-19 14:21:17.0
Essemtec will feature SP003-MLV, a semi-automatic stencil printer with vision for faster control and alignment correction, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2009-10-01 13:19:08.0
The new dual-head MC-385, Manncorp’s latest addition to its popular MC Series of pick-and-place systems, claimed to deliver greater flexibility, higher throughput and lower cost of ownership, will be premiered at SMTA International in San Diego.
Industry News | 2010-10-27 20:21:50.0
Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.
Industry News | 2011-02-10 12:57:14.0
Essemtec AG announces that the new product video on its Tucano is now available for viewing at www.essemtec.com. The video sequence provides a close-up preview of the small footprint stencil printer in action.
Industry News | 2017-12-04 19:06:29.0
Anda Automation is pleased to announce that it has partnered with InterElectronic Hungary, Ltd. as its distributor in Eastern Europe. InterElectronic offers lines for SMT and THT manufacturing for low-, medium- or high-volume production, as well as complete solutions for the automotive industry.
Industry News | 2018-08-16 19:42:31.0
Anda Technologies USA, Inc., a leading provider of fluid application and custom design manufacturing equipment, features a line of precision high-performance fluid dispensing and underfill systems. iJet-Table Dispenser Models 250 & 350 are useful for many applications such as SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, as well as flat panel assembly. The machines boast a max speed of 600 mm/second and 0.02 mm precision and repeatability.
Industry News | 2021-05-14 06:22:26.0
Anda Technologies received the 2021 CIRCUITS ASSEMBLY Service Excellence Award (SEA) in the Dispensing Equipment category for its outstanding customer ratings. The award was announced during a special online awards ceremony on Tuesday, April 6, 2021.
Industry News | 2018-10-11 19:33:26.0
Anda Technologies USA announces that its Board Handling Conveyors are ideal for a range of PCB handling applications and can optimize Work-In-Progress (WIP) material flow during assembly, coating, dispensing and other processes.
Industry News | 2007-10-04 14:31:00.0
MORRISVILLE, NC -- September 24, 2007 -- Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will feature the KE-2080 High-Speed Flexible Mounter in booth 317 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
