Industry News | 2012-03-30 18:18:57.0
Seica China will be an exhibitor at the Nepcon Shanghai being held on April 25th to 27th. The featured systems in booth # 1 H70 will include the Pilot V8 Flying Prober and the RTE-200 System.
Industry News | 2008-01-23 10:17:05.0
SUN VALLEY, CA � January 17, 2008 � Creative Automation Company announces new solutions for automation and dispensing for today�s biomedical industry.
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2017-10-17 19:38:01.0
Vi TECHNOLOGY will exhibit in Hall A2, Stand 421 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. The Vi TECHNOLOGY team is preparing for a busy show, with plans to bring two 5K3D AOI systems and two PI 3D SPI systems as well as the new software module Sigma Line. productronica is the world’s leading trade fair for electronics development and production, and Vi TECHNOLOGY is bringing the latest innovations from its leading product line to offer live demos.
Industry News | 2011-08-24 21:38:06.0
From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.
Industry News | 2014-10-01 13:08:36.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 Global Technology Award for its Camera Assist Automatic Bondtesting.
Industry News | 2007-12-13 20:35:00.0
WALTHAM, Mass., Dec 12, 2007, PerkinElmer, Inc. (NYSE: PKI), a global technology leader in Health Sciences and Photonics, today announced it has received additional production orders for mobile phone flash assemblies incorporating its Xenon-based flash technology.
Industry News | 2013-10-22 14:45:08.0
Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.
Industry News | 2014-01-07 18:42:22.0
Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.
Industry News | 2014-02-11 15:25:57.0
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
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