Industry News | 2012-06-25 12:49:28.0
Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
Industry News | 2012-09-13 14:02:26.0
AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2009-04-23 20:46:52.0
FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2015-01-20 18:02:54.0
Metcal today announced plans to exhibit in Booth #627 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2016-04-12 09:32:03.0
Metcal has announced that it will exhibit in Hall 7, Stand 109 with distributor SmartTec at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Metcal’s Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the Scorpion Rework System, the MX-5200 Soldering & Rework System, and the soon-to-be-launched Solder Wire Feeder.
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2015-01-20 23:40:52.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
