Industry News: can sac305 solder on immersion ag (Page 1 of 7)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMTA International Technical Committee Announces Best Presentation & Paper Awards from the 2019 Conference

Industry News | 2020-03-19 13:12:42.0

The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

Nihon Superior’s Keith Howell to Present at International Conference on Soldering and Reliability

Industry News | 2010-05-05 21:42:51.0

OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.

Nihon Superior Co., Ltd.

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability

Industry News | 2013-11-08 17:55:20.0

Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.

Indium Corporation

NEPCON South China 2011 to Focus on New Product Innovations

Industry News | 2011-08-01 16:38:05.0

Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions.

Reed Exhibitions - RX (Reed Exhibitions)

EVS International Signs on Competitive Edge Solutions in New England

Industry News | 2022-04-13 10:26:25.0

EVS International is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers' representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).

EVS International

New Thermal Fatigue Resistant Lead-free Solder Paste

Industry News | 2021-06-08 03:45:26.0

SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

Shenmao Technology Inc.

SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements

Industry News | 2022-03-14 08:20:37.0

SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

Shenmao Technology Inc.

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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

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