Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Industry News | 2010-09-13 15:26:59.0
IPC — Association Connecting Electronics Industries® will bring together some of the brightest minds in the electronics industry for three free technical sessions at Electronics Midwest. Held September 28–29, 2010, at the Donald E. Stephens Convention Center, in Rosemont, Ill., the sessions will provide answers and insights into the challenges in printed board fabrication and assembly technologies as well as manufacturing with sustainability in mind.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Industry News | 2018-10-18 10:28:01.0
The Future of Embedded Passive Components
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2020-01-07 11:42:27.0
Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.
