Industry News: carbon pad (Page 1 of 2)

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012

Industry News | 2012-07-10 11:27:53.0

Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight SN100C Products at SMTAI 2009

Industry News | 2009-09-17 15:06:04.0

OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at Productronica India 2011

Industry News | 2011-09-01 21:35:02.0

Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at Electronics For You Expo 2012 (EFYEXPO2012)

Industry News | 2012-01-24 15:15:34.0

Nihon Superior (Singapore) Pte. Ltd. will showcase a new, expanded range of SN100C products in booth B-74B at the upcoming Electronics For You Expo 2012 , scheduled to take place February 16-18, 2012 in Hall No. 11 B, at the Pragati Maidan in New Delhi, India.

Nihon Superior Co., Ltd.

ECT Introduces A7 Flying Probe Test System from atg-LM

Industry News | 2012-04-30 14:15:09.0

Everett Charles Technologies (ECT) introduces the new A7Cf Flying Probe Test System from atg-LM. The double-sided test system features four probes on top and four additional probes on the bottom

Everett Charles Technologies

Conductive Compounds Announces Formable Conductive Inks for Molded Plastic Assemblies

Industry News | 2012-07-31 15:57:01.0

Printable, formable conductive inks that can be applied to a flat plastic substrate and then molded into various shapes offer exciting new opportunities to engineers and designers trying to incorporate internal electronic circuitry into molded automotive and aircraft interior parts, as well as a wide variety of industrial and consumer electronic assemblies...

Conductive Compounds, Inc.

Nordson MARCH Receives NPI Award for its RollVIA Self-contained Vacuum Plasma System

Industry News | 2018-03-07 07:37:28.0

Nordson MARCH announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.

MARCH Products | Nordson Electronics Solutions

Nordson MARCH Receives Vision and Innovation Awards at NEPCON China for its RollVIA Self-contained Vacuum Plasma System

Industry News | 2018-05-31 10:23:37.0

Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.

MARCH Products | Nordson Electronics Solutions

ECT to Debut New HyperCore Base Material at SEMICON West 2012

Industry News | 2012-06-11 18:32:49.0

Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore in Booth #6557 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Everett Charles Technologies

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