Industry News | 2003-05-08 07:11:45.0
InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.
Industry News | 2016-08-13 19:54:46.0
JTAG Technologies return to SMTA in 2016 to premiere several new hardware products for PCB testing and In-System [Device] Programming.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2014-06-30 14:25:43.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
Industry News | 2014-07-08 11:04:03.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.
Industry News | 2014-08-12 16:03:12.0
(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
Industry News | 2018-05-14 10:30:22.0
The world's first commercial diamond filled underfill.
Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
Industry News | 2002-04-05 08:29:22.0
Detected an Undisclosed Error With Its CDMA2000 1X MSM5100 and MSM5105 Chip Sets and Software
