Industry News: casing (Page 10 of 100)

SMTA INTERNATIONAL CONFERENCE PROGRAM FINALIZED AND AVAILABLE ON-LINE

Industry News | 2008-05-03 17:23:25.0

MINNEAPOLIS, MN � The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai. The conference will be held at Disney's Coronado Springs Resort and Convention Center in Orlando, Florida on August 17 - 21. This year�s program allows the attendee to choose from 24 courses, 100 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.

Surface Mount Technology Association (SMTA)

Medical Electronics Symposium Keynote Speakers Announced

Industry News | 2009-08-21 23:20:40.0

Minneapolis, MN – The SMTA and MEPTEC are proud to announce the keynote speakers for their co-organized 2009 Medical Electronics Symposium

Surface Mount Technology Association (SMTA)

SMTA International Call for Papers

Industry News | 2010-02-17 18:45:59.0

The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

IPC and SMTA to Host Comprehensive Conference on High Performance Cleaning and Coating

Industry News | 2010-09-15 22:05:31.0

IPC — Association Connecting Electronics Industries® in partnership with SMTA will host a High Performance Cleaning and Coating Conference, November 16–18, 2010, at the Renaissance Hotel & Convention Center, Schaumburg, Ill. The uniquely focused conference will provide intense coverage of technological developments in all areas of cleaning and coating, applied to electronics assemblies.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for 2012 IPC APEX EXPO™

Industry News | 2011-05-03 22:58:11.0

IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2012 IPC APEX EXPO™ at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 28–March 1, 2012, and the professional development courses will be February 26–27 and March 1, 2012.

Association Connecting Electronics Industries (IPC)

SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards

Industry News | 2011-09-06 15:20:36.0

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Surface Mount Technology Association (SMTA)

Complying with the Moving Target of U.S. Export Controls - IPC Workshop to Provide Answers on Evolving ITAR and EAR

Industry News | 2011-09-19 18:12:59.0

In the realm of what you don’t know can hurt you, U.S. regulations on the import and export of sensitive electronics are constantly evolving. To help PCB manufacturers ensure compliance with International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR), IPC will hold a comprehensive workshop, ITAR/EAR Compliance for PCB Manufacturers - Complying with U.S. Export Controls, December 6–7, 2011, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

IPC Sponsors International Academiv Paper Competition

Industry News | 2011-10-03 15:19:17.0

IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.

Association Connecting Electronics Industries (IPC)

PB Swiss Tools Introduces PC Repair Toolkit

Industry News | 2011-10-12 21:06:56.0

Count On Tools debuting the PB Computer Repair Toolkit from PB Swiss Tools. The new toolkit is designed for repair technicians and field service personnel to install, maintain and troubleshoot PCs, workstations and more.

Count On Tools, Inc.

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)


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