Industry News: castelation (Page 1 of 1)

IPC INTERNATIONAL ACADEMIC COMPETITION WINNERS TO PRESENT RESEARCH AT IPC APEX EXPO 2012

Industry News | 2012-01-10 19:20:12.0

IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Plated Half-Holes(Castellated Holes)

Industry News | 2019-11-05 22:17:26.0

Plated half holes(castellated holes)are holes that made off the edge of the boards plated with copper using a specialized process. It is predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. Through connecting the PCBs together directly, the whole system is considerably thinner than a comparable connection with multi-pin connectors.The plated edges are also useful in producing mini PCB modules.

Headpcb

Ucamco updates Gerber File Specification

Industry News | 2016-01-06 11:10:25.0

Ucamco published revision 2016.01 of the Gerber Format Specification. This revision adds new attributes for castellated holes (or PTH on the board edge) and for tooling and break-out holes.

Ucamco

Barry Industries Introduces Hermetically Sealable HTCC Air-Cavity Quad-Flat-No-Lead (QFN) Packages to 40GHz

Industry News | 2013-11-14 18:35:01.0

Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.

Barry Industries, Inc.

Elimiate solder voids online we show you how

Industry News | 2015-03-16 06:51:04.0

Void Formation in Solder Joints – Causes & Cures Webinar Monday 18th May 2.30pm GMT Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection.

ASKbobwillis.com

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