Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Industry News | 2022-05-18 12:24:25.0
Supply Chain Crisis: When will the Chip Shortage End? What is the solution? Supply Chain issues are prevalent, causing a supply crunch and resulting in cut production, delinquent delivery shortages, and loss of profit. Then there is offshore manufacturing, which poses a security threat as democracy is threatened across the globe. The 2021 National Defense Authorization Act (NDAA) has a call for action to translate American innovation into domestically manufacturable, market-ready technology to provide solutions to the current market threats.
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2003-03-14 08:18:03.0
The instruction is intended as a practical user's guide for determining if a failure is related to black pad.
