Industry News: cause coplanarity in connector (Page 1 of 1)

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Industry News | 2017-08-30 16:58:11.0

Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.

Akrometrix

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Panasonic Introduces NPM-D3, the Latest in the Award-Winning NPM-Series

Industry News | 2014-09-09 12:33:50.0

– Panasonic Factory Solutions Company of America introduces the NPM-D3 to the award-winning, multi-functional NPM-series SMT platform. In addition to its interchangeable, plug-and-play placement heads, the NPM-D3 integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI).

Panasonic Factory Solutions Company of America (PFSA)

Data I/O Emphasizes Leadership in Programming Market

Industry News | 2018-08-22 19:54:48.0

Data I/O Corporation recently announced the deployment of its 200th PSV programming system and record revenue in 2017. Both milestones are a testament to the longevity of the pre-programming market, particularly for the automotive, industrial and consumer markets served by Data I/O.

Data I/O Corporation

Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010

Industry News | 2010-05-11 14:43:51.0

Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.

Vi TECHNOLOGY

Free Webinar in Spanish about Optimizing Pin Inspection using True3D Technology

Industry News | 2021-02-17 11:23:44.0

Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, along with its Mexico sales partner Repstronics will deliver a free webinar on Wednesday, 03 March 2021 at 11:00AM CST (GMT-6). Register today and secure your seat in the virtual event to learn from how to reduce costs and increase yields with Koh Young.

Koh Young America, Inc.

Yestech's AOI Role in Hazardous Area Instrument Manufacturing

Industry News | 2013-11-08 11:15:49.0

AOI can be a powerful tool when effective quality management becomes an absolute priority. Below, Andy Bonner, Managing Director at Cupio Yestech Europe demonstrates this with a look at BEKA associates, who are using AOI within their manufacturing operation producing display instruments certified for safe use within potentially hazardous areas..

Nordson YESTECH

Preview for SPS IPC Drives 2015, Nuremberg, November 24th-26th, Hall 8, Booth 8-518 Industry 4.0 - Key to Success in Manufacturing

Industry News | 2015-11-17 23:09:30.0

ADLINK Technology will be present at SPS IPC Drives 2015 in Nuremberg with an array of new, innovative products.

ADLINK Technology, Inc.

Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging

Industry News | 2015-04-07 15:51:51.0

Vi TECHNOLOGY will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Vi TECHNOLOGY

Vi TECHNOLOGY Brings State-of-the-art Inspection to SMTAI

Industry News | 2014-08-28 12:11:35.0

Vi TECHNOLOGY announces that it will exhibit in Booth #319 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Vi TECHNOLOGY

  1  

cause coplanarity in connector searches for Companies, Equipment, Machines, Suppliers & Information

Win Source Online Electronic parts

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Sell Used SMT & Test Equipment

High Precision Fluid Dispensers
Circuit Board, PCB Assembly & electronics manufacturing service provider

World's Best Reflow Oven Customizable for Unique Applications
PCB Depanelizers

"Heller Korea"