Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2001-02-13 08:23:07.0
IPC has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections. This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.
Industry News | 2003-02-07 08:40:55.0
The Industry's Most Invaluable Tool for Quality Assurance and Assembly Departments is Now Available in Japanese, German, Czech and Danish
Industry News | 2003-06-19 08:08:23.0
Release of three new documents highlighting the latest technology developments divulged at recent IPC international conferences.
Industry News | 2003-07-09 09:11:37.0
Release of the first revision to the standard that forms the foundation of IPC�s family of design standards (IPC-2220)
Industry News | 2003-05-08 07:04:57.0
Provides Industry with Strategic Assistance for the Future
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2017-01-09 08:56:28.0
The solder paste and stencil printing photo CD-ROM album featuring over 300 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The images can be downloaded or provided on CD ROM
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