Industry News | 2020-01-15 15:51:08.0
Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Industry News | 2014-03-20 10:03:43.0
ADLINK Technology announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed IO’s, an advanced graphics engine, and virtualization support - all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.
Industry News | 2010-09-29 23:17:20.0
Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.
Industry News | 2015-06-09 22:28:34.0
ADLINK Technology today announced the release of the ETOS-1000 rugged edge server. ADLINK's new ETOS-1000 is the first high-performance mobile-edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications.
Industry News | 2015-07-28 16:23:06.0
ADLINK Technology will offer its first COM Express® Basic Size Type 6 module incorporating the latest Intel® Xeon® E3-1200 processor and Intel® Core™ i7 processor (formerly codenamed "Broadwell") with Intel® QM87 Chipset.
Industry News | 2016-03-31 14:44:00.0
ADLINK Technology today announced new COM Express® computer-on-modules (COMs) based on the 6th generation Intel® Core™ i7/i5/i3 processors and latest Xeon® processors. These new modules follow the form, fit, function design principal for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.
Industry News | 2016-08-17 13:18:12.0
ADLINK Technology introduced its latest network appliance with the most flexible I/O options currently available on the market. With eight NIM (Network Interface Module) slots and five 2.5’’ HDD drive bays, the CSA-7200 offers extended configuration possibilities for the network security market and is our initial network appliance built using MICA (Modular Industrial Cloud Architecture), which enables fast reconfiguration and reduces time-to-market for new applications.
Industry News | 2016-09-29 23:16:55.0
ADLINK Technology introduces the cPCI-6940 processor blade featuring the Intel® Xeon® processor D-1500 and AMD Radeon™ E8860 embedded GPU. The cPCI-6940 6U CompactPCI processor blade offers up to 16-core computing power and high-performance graphics in a robust design. With an extended operating temperature range of -45°C to 85°C and 16GB of DDR4 soldered memory, the cPCI-6940 is ideal for the rugged environments encountered by military field vehicles and naval or aerospace carriers.
Industry News | 2008-05-30 16:14:19.0
The brand-new facility will be located in the heart of the Silicon Valley in Newark, CA, and is scheduled to open June 5th, 2008. phoenix|x-ray will celebrate this important milestone on June 5th, 2008 with an open house and technical symposium at the new site.
