Industry News: cellebrite and touch (Page 9 of 13)

Trans-Tec Worldwide and Yamaha IM America Showcase Winning SMT Assembly Technology at SMTAI 2016

Industry News | 2016-09-07 18:50:24.0

Yamaha IM America will exhibit dynamic new SMT assembly technology in booth #813 at the upcoming SMTAI International Conference and Exhibition which takes place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.

Yamaha Motor IM America, Inc.

Rugged VPX Processor Blade Offers Server-Grade Performance to Boost Computing Power, GPGPU Acceleration and Workload Throughput

Industry News | 2017-01-20 20:03:05.0

ADLINK Technology introduces its VPX3010 Series rugged 3U VPX processor blade with 12-core Intel® Xeon® Processor D-1500 SoC for server-grade computing performance. A VPX3010 quick start kit and GPGPU companion products, such as an optional discreet VPX GPGPU blade or XMC module with the 384 CUDA core NVIDIA GeForce GT 745M GPU, help to reduce development risk and enhance the capabilities of the blade.

ADLINK Technology, Inc.

CyberOptics Demonstrates Industry-Leading Airborne Particle and Ultra High-Resolution MRS Sensors at SEMICON Europa

Industry News | 2018-10-27 15:55:26.0

CyberOptics® Corporation announces that it will exhibit at SEMICON Europa, scheduled to take place Nov. 13-16, 2018 at the Messe Munchen in Munich, Germany. The company will demonstrate its next-generation Airborne Particle Sensor™ technology (APS3) 300mm with new ParticleSpectrum™ software in Hall A4, booth 101.

3M Electrical Solutions Division

Europlacer to Showcase Assembly Lines, Storage and Integrated CFX Functionality at APEX 2019

Industry News | 2019-01-22 12:36:28.0

Europlacer Americas announces that it will exhibit two SMT assembly lines in Booth #2511 at the upcoming 2019 IPC APEX Expo. The high-speed line will feature the company’s award-winning, ultra-flexible atom3 placement machine downstream from the advanced EP710 AVi Screen Printer. The mid-range, very-large-board manufacturing solution consists of the company’s flagship iineo+ Multi-Functional Placement System with advanced LED binning in line with its EP1220 Long Board Screen Printer.

EUROPLACER

Engineered Conductive Materials Appoints EMJS Tech, Inc. to Represent Its Sol-Ag Line of Conductive Adhesives and Grid Inks in Korea

Industry News | 2011-07-13 15:01:14.0

Engineered Conductive Materials announces that EMJS Tech, Inc. will represent its Sol-Ag line of conductive adhesives and grid inks throughout Korea.

Engineered Conductive Materials, LLC

DEK Reveals Remarkable New Metallization System and Uses Real Silicon Cells

Industry News | 2008-09-30 23:36:57.0

Mass imaging specialist DEK chose this year's EU PVSEC show in Valencia to reveal its new PV1200 Metallization line to the European market. It is the first time that DEK has directly promoted its innovative new solution in this region since launching the product line in March.

ASM Assembly Systems (DEK)

The new SIPLACE SX Road Show is traveling across Mexiko, Canada and the U.S.

Industry News | 2009-11-01 18:10:15.0

The SIPLACE Team is so confident in its new affordable SIPLACE SX concept of "Real Capacity on Demand" that they have taken to the road in the Americas to spread the word. The SIPLACE team is performing live gantry upgrade demonstrations at record breaking speeds. The team is revealing how quickly and easily you can add placement performance to a line without influencing feeder capacity or line length; how easily placement capacity can be moved from one line to another; and how easily feeder capacity can be added without the cost of adding an entire new machine.

Siemens Process Industries and Drives

Indium Corporation Experts Reflect on 80 Years of Technology Innovation and Growth

Industry News | 2014-03-13 11:57:36.0

What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.

Indium Corporation

ADLINK aTCA-9710 AdvancedTCA® Processor Blade Delivers Unmatched Performance With Massive Memory and Reduced TDP.

Industry News | 2014-09-15 11:33:00.0

ADLINK Technology today announced its newest AdvancedTCA® (ATCA) carrier-grade product, the aTCA-9710, which features the dual 12-core Intel® Xeon® processor E5-2600 v3 (formerly codenamed "Haswell-EP") paired with the Intel® Communications Chipset 8920 series (formerly codenamed "Grantley"). The aTCA-9710 offers 16 channels of DDR4-2133 VLP RDIMMS, enabling higher clock and data transfer rates than those seen in previous generation memory.

ADLINK Technology, Inc.

ADLINK aTCA-9710 AdvancedTCA® Processor Blade Delivers Unmatched Performance With Massive Memory and Reduced TDP.

Industry News | 2014-09-15 11:33:01.0

ADLINK Technology today announced its newest AdvancedTCA® (ATCA) carrier-grade product, the aTCA-9710, which features the dual 12-core Intel® Xeon® processor E5-2600 v3 (formerly codenamed "Haswell-EP") paired with the Intel® Communications Chipset 8920 series (formerly codenamed "Grantley"). The aTCA-9710 offers 16 channels of DDR4-2133 VLP RDIMMS, enabling higher clock and data transfer rates than those seen in previous generation memory.

ADLINK Technology, Inc.


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