Industry News | 2003-03-26 08:43:33.0
Dr. Jeffrey Graves has been named President and Chief Executive Officer, effective immediately.
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2003-07-10 08:36:25.0
To execute this strategic plan, KEMET is reorganizing its operations around the world.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2023-05-27 08:28:25.0
Axial insertion machines are used for components with leads that are parallel to the PCB, while radial insertion machines are used for components with leads that are perpendicular to the PCB.
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2023-01-16 07:35:11.0
The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.
Industry News | 2016-04-20 10:27:40.0
BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.
Industry News | 2016-01-05 16:10:10.0
Novel method for protecting electronic components from heat.
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