Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2023-01-16 07:35:11.0
The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2018-09-06 15:18:14.0
Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing
Industry News | 2023-04-05 20:46:03.0
CDE Expands Product Offerings through New Yorker Electronics and Unveils Advanced Custom Capacitor Capabilities
Industry News | 2018-03-13 16:34:13.0
NEO Tech announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.
Industry News | 2020-12-21 09:11:22.0
Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences
Industry News | 2005-08-03 13:41:41.0
Combining Low 130-mV Dropout with High 150-mA Current
