Industry News: ceramic substrate (Page 1 of 6)

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

IPC AND JPCA DEVELOP FIRST OPERATIONAL-LEVEL STANDARD FOR THE PRINTED ELECTRONICS INDUSTRY

Industry News | 2012-07-17 20:55:30.0

First Step in IPC’s Printed Electronics Initiative to Help Industry Grow

Association Connecting Electronics Industries (IPC)

IPC’s NCEDAR CONFERENCE AIMS TO BOOST INDIA’S ELECTRONICS INDUSTRY

Industry News | 2012-11-27 15:24:14.0

IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.

Association Connecting Electronics Industries (IPC)

Count On Tools Offers Urethane Nozzle Series for Ultra-Smooth Components

Industry News | 2012-08-28 09:54:11.0

Count On Tools Inc., announces a breakthrough in custom nozzle engineering for ultra-smooth components from the semiconductor market.

Count On Tools, Inc.

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Heraeus Electronics to Present "Al2O3, ZTA, AMB and What's Next?" at PCIM Europe

Industry News | 2022-05-18 12:37:13.0

Heraeus Electronics today announced that Bastian Schlüter, Global Product Manager Metal Ceramic Substrates, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "Al2O3, ZTA, AMB and What's Next?" is scheduled to take place May 11, 2022 at 12:50 p.m.

Heraeus

Heraeus Electronics Announces Global Launch of Condura®.ultra Ag Si3N4 free AMB Substrate at PCIM Europe

Industry News | 2022-05-18 12:32:37.0

Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.

Heraeus

MARTIN’s EXPERT 04.6IXM: Reworking Heavy Substrates

Industry News | 2012-06-04 11:39:23.0

MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.

Finetech

Heraeus Electronics Exhibits at PCIM Europe May 10-12th

Industry News | 2022-04-13 10:29:39.0

Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.

Heraeus

NPL New 2019 Webinars are Launched

Industry News | 2018-11-20 06:46:05.0

The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research http://www.npl.co.uk/science-technology/electronics-interconnection/webinars/

ASKbobwillis.com

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