Industry News: chip component mounter (Page 1 of 110)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Kit Checks Out Pick-and-Place Equipment

Industry News | 2003-06-18 07:56:46.0

The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

Altium Unveils New �Board-on-Chip� Technology

Industry News | 2003-04-30 08:37:19.0

Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs

SMTnet

Repair Services Being Outsourced by OEMs and EMS Firms

Industry News | 2003-03-06 08:43:16.0

Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

Surface-mount technology about (SMT:printing+chip mounter+reflow oven)

Industry News | 2018-10-18 09:17:59.0

Surface-mount technology about (SMT:printing+chip mounter+reflow oven)

Flason Electronic Co.,limited

Count On Tools Inc. Expands Samsung-Hanwha Nozzles for EXCEN Equipment

Industry News | 2017-08-10 18:38:21.0

Count On Tools Inc. is pleased to announce that it now offers a complete line of nozzles for the Samsung – Hanwha Techwin EXCEN chip mounters. These nozzle designs enable highly accurate, repeatable, optimized chip placement. The expanded series of Samsung – Hanwha replacement nozzles for the EXCEN HS high0speed placement heads offers a high productivity, low-cost alternative to OEM nozzles. Most standard nozzles are available in a variety of materials, such as durable ceramics.

Count On Tools, Inc.

COT expands NXT nozzle line for new H24 head

Industry News | 2017-07-12 17:13:57.0

Count On Tools Inc. announces the expansion of the Fuji NXT Nozzle Series for the new H24 mounter head. The new high-speed head from Fuji achieves improved productivity over previous models. Standard nozzles from Count On Tools compliment this mounter to provide increased reliability and performance within the Fuji NXT III platform of machines.

Count On Tools, Inc.

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