Industry News: chip crack (Page 1 of 6)

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

Best Technical Conference Papers at IPC APEX EXPO 2024 Selected

Industry News | 2024-03-11 14:58:44.0

New this year, student scholarship awarded by IPC Education Foundation

Association Connecting Electronics Industries (IPC)

Christopher Associates Debuts White Solder Mask for LED Applications from OTC

Industry News | 2011-05-19 21:51:24.0

Christopher Associates introduces Onstatic Technology Corp.’s (OTC) R-500 WH White LPI Solder Mask, designed specifically for LED lighting applications.

Christopher Associates Inc.

Cobar Europe Introduces New Products from Yincae Advanced Materials

Industry News | 2010-09-16 21:44:04.0

The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.

Cobar Solder Products Inc.

JNJ Industries Announces 30" Metal Squeegee Blades

Industry News | 2003-01-24 07:53:59.0

JNJ Industries, Inc. announces that its line of metal squeegee blades with the proprietary Electrolized plating are now available in lengths up to 30", increased from the original 24" maximum length. The length of the blades has been increased to meet the needs of newer large-format printers with their expanded print areas from manufacturers including Speedline, Ekra, Panasonic, Surface Mount Techniques, and others used for printing telecom boards, back-planes, and oversized PCBs.

JNJ Industries, Inc.

Koh Young Returns to Semicon West with New Inspection Solutions Designed for Semiconductor and Advanced Packaging Challenges

Industry News | 2023-06-12 20:40:57.0

Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is pleased to announce its return to SEMICON West with a new series of inspection solutions designed to increase advanced package and semiconductor yield. Several of our latest inspection machines will be on display during SEMCION West in booth 329 from 11-13 July 2023 in the Moscone Center, San Francisco, CA.

Koh Young America, Inc.

Altus Provides Precision Inspection for Advanced Semiconductor Packaging

Industry News | 2023-10-30 12:14:11.0

Altus Group is enabling manufacturers to adopt advanced semiconductor packaging techniques with Koh Young's Meister D automated optical inspection (AOI) systems.

Altus Group

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