Industry News: chip die damage by heatsink (Page 1 of 1)

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation

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