Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2021-09-30 16:32:21.0
IPC issued the following statement by its President and CEO, John Mitchell, on today's inaugural meeting of the U.S.-EU Trade and Technology Council.
Industry News | 2010-07-15 14:19:11.0
Now an authorized distributor for Chip Quik products.
Industry News | 2024-02-12 13:44:30.0
In a letter signed by 54 microelectronics executives, IPC and Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.
Industry News | 2023-11-27 12:41:47.0
$3 Billion in CHIPS Act Funding to Support Vital Electronics Technology
Industry News | 2024-03-04 12:05:31.0
IPC praised today's issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
Industry News | 2022-10-11 17:18:48.0
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
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