Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2021-09-30 16:32:21.0
IPC issued the following statement by its President and CEO, John Mitchell, on today's inaugural meeting of the U.S.-EU Trade and Technology Council.
Industry News | 2010-07-15 14:19:11.0
Now an authorized distributor for Chip Quik products.
Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
Industry News | 2014-01-21 18:29:32.0
SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose.
Industry News | 2017-03-06 12:46:42.0
Nordson ASYMTEK will present a technical paper and poster session at the IMAPS Device Packaging Conference being held at the WeKoPa Resort & Casino in Scottsdale/Fountain Hills, Arizona, March 7-9, 2017.
winsouce.jpg)
.gif)