Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-03-28 08:24:43.0
The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.
Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2011-04-01 13:21:14.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
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2481 Hilton Drive
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Phone: (770) 538-0411