Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2014-01-30 17:35:39.0
Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.
Industry News | 2009-12-07 18:55:54.0
Solothurn, Switzerland - October2009 - JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, Flexible Mounters, Intelligent feeders and Software in Hall A3, Stand 143 of the Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2020-07-14 15:55:46.0
Mycronic US is pleased to announce that all of its operations have been successfully integrated into a new state-of-the-art, 102,000 square-foot facility in Tewksbury, near Boston, Massachusetts. This brings together under one roof the Global Technologies division comprising of MRSI Systems and AEi and the US operations of Mycronic's High Flex division.
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Industry News | 2011-09-06 14:29:23.0
At Productronica 2011, Finetech will present a number of smart improvements and new options for the FINEPLACER® lambda.
Industry News | 2018-08-14 17:57:21.0
Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
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