Industry News: chip self alignment (Page 3 of 25)

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Industry News | 2021-08-26 11:02:27.0

SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

Shenmao Technology Inc.

NEW RF CENTER PROBE TEST SOCKET FOR DEVICES

Industry News | 2004-09-29 21:38:11.0

Frenchtown, NJ, September 2004

Aries Electronics Inc

Get a New Level of Soldering Control with Metcal’s Solder Wire Feeder at SMTAI

Industry News | 2016-08-31 18:32:48.0

Metcal today announced plans to exhibit in Booth #806 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will show the Metcal USF-1000 Solder Wire Feeder, along with Metcal’s proven rework and repair equipment, including the Scarab Site Cleaning System, Scorpion Rework System, MX-5200 Soldering System and more. The new Metcal USF-1000 Solder Wire Feeder adds a new level of control and convenience to the soldering process.

Metcal

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

New HITACHI F8 Ultra High Speed Chip Mounter Races Ahead of the Pack to IPC/APEX 2013 Intro

Industry News | 2013-02-01 14:15:35.0

The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA) announces the introduction of the new Sigma F8 Ultra High Speed Chip Mounter, the fastest machine on the market in SMT placement per Ft.2 The new Sigma F8 will be burning rubber all the way to IPC/APEX 2013, where this high-throughput, high-accuracy advancement in chip placement technology will be formally introduced in Booth #2440 along with other innovations including a remarkable new self-loading feeder.

Hitachi High Technologies America, Inc.

Optimizing Test Yield: Multitest’s MT2168 Ensures Best Positioning Accuracy

Industry News | 2011-03-23 15:36:29.0

Multitest announces that its MT2168 pick-and-place handler offers significant yield advantages based on its unique and industry-leading positioning concept.

Multitest Elektronische Systeme GmbH

Allchips Will Hold The 1st China Chip Industry Forum & Application Exchange Conference

Industry News | 2018-12-05 22:34:20.0

On December 21, Allchips will together with electron industry at the Shenzhen International Electronics Exhibition hold ” The 1st China Chip Industry Forum & Application Exchange Conference”, the conference will be held from 10:00 a.m. to 12:00 a.m. on December 21, 2018 in Room 1B, Hall 1, Exhibition Center.

Allchips Limited

Saelig Introduces Sol Chip Battery-Replacing Solar Power Mini-Modules

Industry News | 2017-08-04 15:03:08.0

SCP-2801 Power Modules include all the components that are required to harvest energy from ambient light, charge a built-in rechargeable battery, and deliver a stable voltage to a load.

Saelig Co. Inc.


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