Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2015-10-11 15:35:54.0
New placement modules, tapeless feeders, new screen printers and the first expert system that optimizes SMT processes automatically. At Productronica 2015 (November 10-13, Munich Trade Fair Center), technology leader ASM Assembly Systems will present a show unlike any other under the motto “On the move to the Smart #1 SMT Factory”. On 650 square meters at booth A3.377, the SMT experts will lay out their roadmap to the Smart Factory with a “Speed Quality” line and a “Flexible Quality” line featuring totally innovative technologies. The focus will be best-in-class equipment, automation tools, production process networking and integration, and transparent material logistics. At the “Speed Quality” line, new SIPLACE TX placement modules will ring in the mass placement of super-small 0201 (metric) components. A single SIPLACE TX module alone can place up to 78,000 of these per hour at full speed at smallest footprint. With its compact design, it also sets new records in speed, floorspace performance and placement accuracy. Components in sizes from 0402 through 01005 will be supplied loosely and without tapes thanks to the new SIPLACE BulkFeeder. This ASM innovation finally bans reels and splicing from the SMT production floor. With the DEK NeoHorizon and DEK NeoHorizon Back-to-Back, the ASM team will also unveil new, powerful screen printers. Most of the visitors’ attention, however, will be focused on the ASM ProcessExpert. This first inline expert system in the industry establishes a new product category in electronics manufacturing. By running virtual prints based on Gerber data, the ASM ProcessExpert subjects the stencil to a DFM (design for manufacturability) health check. By stabilizing and optimizing the printing process automatically, this highly innovative system represents a milestone on the path to self-optimizing SMT lines. Each of these innovations constitutes a building block for the Smart Factory.
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Industry News | 2002-04-04 07:58:35.0
A new class of communication chips for routers is pushing the limits for today's IC testers
Industry News | 2008-03-20 16:10:40.0
Essemtec will showcase EXPERT-SAFP universal prototyping station in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2008-08-07 11:52:44.0
Essemtec will display EXPERT-SAFP universal prototyping station in booth 211 at the upcoming SMTA International 2008 exhibition and conference, scheduled to take place August 19-20, 2008, in Orlando, FL.
Industry News | 2008-09-12 03:27:20.0
Essemtec will display EXPERT-SAFP universal prototyping station in booth 907 at the upcoming IPC Midwest exhibition & conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.
Industry News | 2009-03-19 15:08:37.0
Essemtec will feature EXPERT-SAFP universal prototyping station in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2013-11-08 18:07:48.0
Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
