Industry News | 2012-06-18 20:06:38.0
OK International announces that the new Metcal Scorpion Rework System has received a significant amount of positive industry attention, including the prestigious 2012 EM Asia Innovation Award in the category of Repair/Rework Equipment.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2008-08-22 17:03:42.0
Richardson, TX (August 19, 2008 � Intel Developers Forum, Booth No. 356)�ASSET� InterTech (www.asset-intertech.com) today announced that it has reached an agreement under which ScanWorks, the company's platform for open embedded instrumentation tools, will support Avago Technologies' embedded instrumentation technology for applications-specific integrated circuits
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2008-09-16 12:35:27.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER� CRS 10 Compact Rework System in booth #809 at IPC Midwest 2008, scheduled for September 24-25, 2008 in Schaumburg, IL.
Industry News | 2014-01-24 15:31:06.0
Since the Compact Flash Association released the specification of CFast 2.0, Apacer has invested actively in R&D and taken the lead to roll out the first CFast 2.0 memory card - CFast 2, around the globe with SATA 3.0 (6Gb/s) high-speed transmission interface.
Industry News | 2011-01-12 15:27:11.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.
Industry News | 2011-03-22 16:23:31.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2007-10-23 14:43:19.0
Richardson, TX (Oct. 23, 2007) ASSET InterTech is expanding its ScanWorks� system by adding signal integrity analysis applications that support Intel's next-generation embedded instrumentation technology, Intel� IBIST (Interconnect Built In Self Test).
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