Industry News: chips and stuck (Page 8 of 35)

Plexus Announces Licensing and Services Agreement

Industry News | 2002-02-27 07:55:33.0

Plexus Corp. (Neenah, WI) has signed a licensing and services agreement with Tessera Technologies Inc. (San Jose, CA). The licensing agreement enables Plexus to use Tessera's chip scale packaging (CSP) and multi-chip packaging (MCP) solutions to develop and manufacture miniaturized electronic devices. In addition, Tessera will provide Plexus with design collaboration, technology support, technology transfer, and sales and marketing assistance to accelerate their customers' time to market.

Plexus Corporation

Alcatel and MPower Sign Agreement

Industry News | 2002-04-09 09:16:06.0

For the Development of Innovative Battery Protection ICs

Alcatel

Temperature Cycling Test Chamber Testing and Debugging Methods

Industry News | 2020-11-25 21:23:15.0

Each of the conducting processes should be performed, maintaining the test standard assortment of every test's execution. Temperature Cycling Test Chamber at the equilibrium indicates correct evaluation in particular data performance. So, it is a more precise detection of the following test results. Since particular conditions can affect its assessment, it can't run correctly. It means a reduction of inaccurate test results, which is immeasurable. That's why it's vital to make sure this tests' expected behavior is completed in the instance of preparations.

Guangdong Bell Experiment Equipment Co.,Ltd

Practical Components and PACTECH Offer Flip Chip Test & Evaluation Kit and Board

Industry News | 2010-09-22 14:26:54.0

Practical Components Inc., a leading international national distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, announces a new PACTECH PCB310 Flip Chip Test & Evaluation Board for placement and daisy chain continuity testing after assembly.

Practical Components, Inc.

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

KIC to Feature KIC Explorer RF and KIC RPI at Componex/Nepcon India 2009

Industry News | 2009-01-30 16:42:42.0

San Diego � January 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature KIC's new RPI, Reflow Process Inspection. KIC also will be showing the KIC Explorer Dual model that may be used as a datalogger or as a real-time profiler using radio frequency technology. KIC will be in representative Mectronics Marketing Services' booth, located in Hall #18 in booth #406, at the Componex/Nepcon India 2009, scheduled to take place February 24-26, 2009 in New Delhi.

KIC Thermal

KIC to Feature KIC RPI and KIC Explorer RF at Amper Fair, Prague 2009

Industry News | 2009-03-27 10:06:36.0

San Diego � March 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature KIC's new RPI, Reflow Process Inspection.

KIC Thermal

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited


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