Industry News: class 3 14 leads (Page 1 of 196)

New Dispensing & Conformal Coating Products - Live Demo - Booth 2933, APEX San Diego

Industry News | 2017-01-26 19:53:00.0

GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.

GPD Global

Camden Electronics Appoints New Distributor in Germany for Enclosure Products

Industry News | 2003-06-09 09:41:14.0

Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.

SMTnet

AutoTRAX EDA Ltd. Appoints John Shotsky, Former Orcad Product Manager, as EDA Tools Product Manager

Industry News | 2003-02-04 08:49:40.0

John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001

SMTnet

AeA Expands Micro Cap Financial Conference to Web to

Industry News | 2003-04-14 09:17:40.0

AeA Micro Cap Virtual Conference to be held Online May 16th

SMTnet

Innovex, Inc. Files Registration Statement for Public Offering of Common Stock

Industry News | 2003-07-09 08:49:20.0

Proposed offering of 3,000,000 shares of its common stock.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

AsusTeK Selects Cadence SPECCTRAQuest For High-Speed PCB System Development

Industry News | 2003-05-21 09:03:19.0

Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs

SMTnet

DDi Corp. Reports First Quarter Results

Industry News | 2003-05-16 08:49:08.0

PCB Sales Improved

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

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