Industry News | 2014-02-17 19:55:18.0
Count On Tools Inc. (COT)will exhibit its new StripFeeder Modular (.mod) System version 2 in Booth #725 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2015-03-09 18:33:48.0
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to General Microcircuits, Inc. (GMI), an electronics manufacturing company based out of Mooresville. N.C. GMI provides circuit board and integrated assemblies to manufacturers in diverse industries. To earn the QML, GMI successfully completed an intensive audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2017-03-08 19:40:39.0
Yamaha Motor Co., Ltd. (Tokyo: 7272) announces that it has completed construction of the new Hamamatsu IM Base for the IM Business Unit, now located in Toyooka-cho, Kita-ku, Hamamatsu, Shizuoka Prefecture. The IM Business Unit houses the development, manufacture and sales of surface mounters and industrial robots.
Industry News | 2011-02-07 15:33:41.0
Multitest announces that Chris Cuda, US Product Manager, will present a paper titled "Benefits & Risks of High Aspect Ratio Vias in ATE Boards" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona.
Industry News | 2011-10-12 21:39:45.0
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability.
Industry News | 2021-12-13 12:52:59.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Industry News | 2018-09-18 02:49:24.0
Seoul, South Korea – Koh Young Technology, the pioneer and leader in 3D inspection technology, showed the latest Meister-D for the SiP (System-in-Package) assembly process. This innovative technology was recently highlighted at SEMICON Taiwan in the Taipei Nangang Exhibition Center.
Industry News | 2014-08-28 11:30:37.0
SisTech Installs Ersa’s Ecoselect 2 and HotFlow 3.
Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
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