Industry News | 2016-09-19 20:15:36.0
KYZEN today announced plans to exhibit with its distributor, Kreative Technologies, in Booth #3429 at productronica India, September 21-23, 2016 in Bangalore. The KYZEN team will highlight IPA replacements and its AQUANOX® A4625 versatile aqueous cleaning chemistry.
Industry News | 2018-09-26 11:50:32.0
SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2021-02-08 15:13:53.0
KYZEN will participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 at www.ipcapexexpo.org. As 2021 begins with new possibilities, opportunities and potential challenges, KYZEN's solutions are available – and will be on virtual display – for every cleaning process in the manufacturing spectrum. Additionally, be sure to attend live demos of its award-winning, comprehensive Process Control Solutions.
Industry News | 2021-10-07 15:45:29.0
MacDermid Alpha Electronics Solutions announces the release of ALPHA WS-826 water soluble solder paste, designed to provide excellent environmental stability even in extreme operating conditions.
Industry News | 2020-11-09 14:21:48.0
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
Industry News | 2007-11-12 20:08:47.0
ITASCA, IL � November 12, 2007 � Kester announces that it has entered into an agreement with Speedline Technologies during the Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
Industry News | 2020-12-01 02:52:15.0
SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
Industry News | 2018-10-17 20:13:20.0
SHENMAO America, Inc. is pleased to announce that it was awarded a 2018 Global Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
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