Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2022-01-25 08:46:41.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stand L160 at Southern Manufacturing, scheduled to take place February 8th – 10th at FIVE in Farnborough, Hampshire.
Industry News | 2008-04-07 22:22:22.0
March 31, 2008 - EVS International, the leader in solder recovery, announces that it has been awarded an NPI Award in the category of �Soldering, Other� for its innovative EVS 1000 Solder Recovery System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Industry News | 2008-04-07 22:33:54.0
OSAKA, JAPAN � March 31, 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded two 2008 NPI Awards with the Balver Zinn Balver Zinn Group (Balver Zinn, Nihon Superior Co. Ltd., FCT Assembly and DKL Metals) in the category of Soldering Materials and Flux for its innovative SN100C Paste. The awards were presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Industry News | 2009-04-08 19:13:35.0
MORRISVILLE, NC - February 2009 - Juki Corporation announces that it has been awarded a NPI Award in the category of Selective Soldering for its FlexSolder Series. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2007-06-11 10:27:17.0
Building on the successful SM Series of fast, flexible placement systems, Dynatech Technology has added the Samsung Screen Printer SMP300 System - used by Samsung worldwide to assembly consumer and industrial products - to expand its turnkey SMT capability for North American assemblers.
Industry News | 2009-10-16 11:25:26.0
BTNX Offers Free Blood Glucose Meters
Industry News | 2012-02-29 20:13:27.0
Speedprint Technology announces that it has been awarded a 2012 NPI Award in the category of Screen/Stencil Printing Equipment for its SP700avi Screen Printer.
Industry News | 2012-09-20 14:20:40.0
More and more often electronics manufacturers have to deal with large, heavy or very thin boards which frequently require support pins for the placement process in order to prevent warping or vibrations. With its SIPLACE Smart Pin Support, ASM Assembly Systems provides a hardware-software combination that simplifies this previously cumbersome and complex support pin placement process for all boards.
Industry News | 2013-11-05 10:04:10.0
Marquardt GmbH of Rietheim-Weilheim (Germany)uses the Viscom S3088 SPI3D solder paste inspection system.
