Industry News | 2021-02-18 10:56:30.0
Austin American Technology (AAT) is pleased to announce that it has modernized its digital presence by upgrading www.aat-corp.com. The company has updated the website to the latest technology, just as it has with all AAT industry-leading cleaners for the last 35+ years.
Industry News | 2009-04-08 20:41:15.0
Medfield, MA � April 2009 � Milara Inc. announces that it has been awarded an SMT VISION Award in the category of Printing for its TouchPrint Digital TD2929 Automatic Inline Printer. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2009-04-08 20:47:21.0
Medfield, MA � April 2009 � Milara Inc. announces that it has been awarded an NPI Award in the category of Screen/Stencil Printing for its TouchPrint Digital TD2929 Automatic Inline Printer. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2024-04-22 10:33:57.0
ZESTRON is delighted to announce Angela Marquez's appointment as the new Head of the Business Unit for Latin America. Angela Marquez brings a wealth of expertise and insight to her new role. Before joining our team, Angela served as the Business Unit Director for LATAM at Actnano, Inc., where she exhibited exceptional leadership in driving business growth and fostering strategic partnerships.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2021-10-04 13:37:14.0
KYZEN will exhibit in Booth #3325 during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN.
Industry News | 2003-05-05 08:32:30.0
Nepcon UK in Brighton will host the latest in electronics materials and electronics reliability measurement equipment from Concoat.
Industry News | 2007-02-05 13:03:47.0
Multi-tech Stencil Cleaner provides ultimate chemistry flexibility
Industry News | 2018-02-19 10:15:21.0
FREE-SAT™ FS-NTP-1711.85 by High-Tech Conversions are 11” x 17” polypropylene wipes designed for general purpose wiping and surface preparation in industrial, aerospace, and automotive manufacturing. They are presaturated with 85% isopropyl alcohol / 15% DI water, making them suitable for removing grease, oil and residue.
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